Power Management Strategies Incorporating Thermal Considerations for Integrated Power Amplifiers in Digital Phased-Array Systems

Shayan Samadian Barzoki¹ Arash Azizpor² Pourya Ahmadi Amirabadi³

Abstract :
Digital phased-array transmitters operating at millimeter-wave (mm-wave) frequencies require the ultra-dense integration of high-frequency monolithic power amplifiers (PAs). However, high power density in compact monolithic microwave integrated circuits (MMICs) leads to severe localized heat dissipation, elevated junction temperatures, accelerated electromigration, increased intermodulation distortion, and spatial thermal gradients within the active element channels. This paper presents a comprehensive, temperature-aware power management method designed for digital phased-array power amplifiers implemented in GaN-on-SiC and SiGe BiCMOS technologies. We propose an integrated framework that combines dynamic supply-voltage scaling (DVS), adaptive envelope tracking (ET) under digital beamforming variations, and transistor layout structures to compensate for thermal gradients. Through electromagnetic, thermal, and circuit-level simulations, we demonstrate a junction temperature reduction of up to 28°C while maintaining a power-added efficiency (PAE) exceeding 38.5% at 28 GHz. The proposed strategies mitigate spatial thermal coupling between adjacent array tiles, stabilize EVM performance across varying steering angles, and enhance the overall lifetime reliability of next-generation 5G/6G and digital beamforming radar systems.

Keywords : digital phased arrays integrated power amplifiers (pas) thermal management millimeter wave (mm wave) envelope tracking junction temperature power added efficiency (pae)

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زبان مقاله : انگلیسی
محور مقاله : مهندسی برق
محل انتشار : چهارمین کنگره بین المللی علوم، مهندسی و فن آوری های نو
آدرس وب سایت کنفرانس : secongress.com
کد IOI مقاله : ACCA-ACZBEF
لینک مستقیم مقاله : https://isnac.ir/ACCA-ACZBEF
نمایش چکیده فارسی : https://isnac.ir/SA/ACCA-ACZBEF

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